Eddy-current probe

Electricity: measuring and testing – Magnetic – With means to create magnetic field to test material

Reexamination Certificate

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Details

C324S228000

Reexamination Certificate

active

07012425

ABSTRACT:
An eddy-current probe according to the present invention comprises: a substrate having a first surface facing to a subject to be tested and a second surface opposite to said first surface; an exciting coil formed on the second surface, having a pair of current lines in parallel with each other through which exciting currents flow in opposite directions to each other during testing, for generating an alternate magnetic field applied to the subject by the exciting currents; and at least one eddy-current sensor positioned on a central axis between the pair of current lines on the second surface of the substrate, for detecting a magnetic field generated newly from the subject by an eddy-current induced by the alternate magnetic field. The substrate has a non-planar form having at least one convex-surface portion on the first surface, and the at least one eddy-current sensor is formed on at least one concave-surface portion formed on the second surface, which is corresponding to the at least one convex-surface portion.

REFERENCES:
patent: 6784662 (2004-08-01), Schlicker et al.
patent: 2001/0054894 (2001-12-01), Goldfine et al.
patent: 07-083884 (1995-03-01), None
patent: 08-101167 (1996-04-01), None
patent: 09-189682 (1997-07-01), None
patent: 11-051905 (1999-02-01), None
patent: 11-248685 (1999-09-01), None
patent: 2000-080535 (2000-03-01), None
patent: 2002-090490 (2002-03-01), None
patent: 2003-162805 (2003-06-01), None
Miyagoshi et al., “Feasibility of Inspecting Defects in Printed Circuit Boards by Using Eddy-Current Testing Techniques”, Journal of the Magnetics Society of Japan, vol. 23, No. 4-2, pp 1613-1616, 1999 (cited in specification).
Yamada et al., “Trend of Detection Techniques Using Planar—Type Micro-Eddy-Current Testing”, Journal of the Magnetics Society of Japan, vol. 23, No. 7, pp. 1817-1825, 1999 (cited in specification).
Nakamura, Kazunori et al., “ECT Multi-Sensor for Inspection of Printed Circuit Boards.” The 15thSymposium on Electromagnetic and Dynamics, May 28, 2003, pp. 339-342.

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