Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2006-07-18
2006-07-18
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S108000, C438S907000
Reexamination Certificate
active
07078272
ABSTRACT:
A method of making a microelectronic device comprising: making a device B comprising providing a structure having a first bond pad, depositing a first electrically conductive material having a first reflow temperature over the first bond pad, and depositing a second electrically conductive material having a second reflow temperature over the first electrically conductive material, and wherein the second reflow temperature is less than the first reflow temperature, and heating the device to a temperature sufficient to reflow the second electrically conductive material but not the first electrically conductive material so that the second electrically conductive material encapsulates the first electrically conductive material to provide a first bump for making electrical connection to device B.
REFERENCES:
patent: 6536653 (2003-03-01), Wang et al.
patent: 6857557 (2005-02-01), Hua
Ho Chi-Shen
Lin Chang-Ming
Aptos Corporation
Dang Phuc T.
Tung & Associates
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