Semiconductor wafer transport method and semiconductor wafer...

Details Semiconductor wafer transport method and semiconductor wafer... Semiconductor wafer transport method and semiconductor wafer...

2006-07-18

2006-07-18

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S758000, C414S806000, C414S935000, C269S021000, C257SE21122

Reexamination Certificate

active

07078262

ABSTRACT:
A wafer formed thin through a back grinding process is placed on a support table included in an alignment stage. When a faulty suction is caused by a warp of the wafer, a surface of wafer is pressed by a pressing plate to be corrected and held by suction. The wafer held by suction is transported, along with the alignment stage, to a mount frame preparing unit at the next step. The wafer is received while being held by suction by a chuck table contacting the surface of wafer.

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