Ceramic package with radiating lid

Details Ceramic package with radiating lid Ceramic package with radiating lid

2006-05-30

2006-05-30

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S712000

Reexamination Certificate

active

07053482

ABSTRACT:
A ceramic package with a lid attached thereon, which has radiating grooves at its upper surface and/or lower surface to radiate heat generated from a chip-type device is disclosed. The ceramic package includes a laminated ceramic substrate comprised of a plurality of ceramic substrate such that a cavity is centrally defined in the laminated ceramic substrate, a chip-type device mounted on the bottom of the cavity of the laminated ceramic substrate, and a lid attached to the top of the laminated ceramic substrate to close the cavity, which is provided at its upper and/or lower surface with protrusions to efficiently radiate heat generated from the chip-type device.

REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5977623 (1999-11-01), Ahn
patent: 55165658 (1980-12-01), None
patent: 56133853 (1981-10-01), None
patent: 62-057238 (1987-03-01), None
patent: 05-029485 (1993-02-01), None
patent: 08-083867 (1996-03-01), None
patent: 08-195451 (1996-07-01), None

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