Method for testing using a universal wafer carrier for wafer...

Details Method for testing using a universal wafer carrier for wafer... Method for testing using a universal wafer carrier for wafer...

2006-09-26

2006-09-26

Karlsen, Ernest (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S755090

Reexamination Certificate

active

07112986

ABSTRACT:
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

REFERENCES:
patent: 3731191 (1973-05-01), Bullard et al.
patent: 3849872 (1974-11-01), Hubacher
patent: 4169642 (1979-10-01), Mouissie
patent: 4281449 (1981-08-01), Ports et al.
patent: 4340860 (1982-07-01), Teeple, Jr.
patent: 4390220 (1983-06-01), Benasutti
patent: 4467400 (1984-08-01), Stopper
patent: 4506938 (1985-03-01), Madden
patent: 4554505 (1985-11-01), Zachry
patent: 4560216 (1985-12-01), Egawa
patent: 4585991 (1986-04-01), Reid et al.
patent: 4597617 (1986-07-01), Enochs
patent: 4729166 (1988-03-01), Lee et al.
patent: 4739257 (1988-04-01), Jenson et al.
patent: 4766371 (1988-08-01), Moriya
patent: 4783719 (1988-11-01), Jamison
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4918374 (1990-04-01), Stewart et al.
patent: 4924353 (1990-05-01), Patraw
patent: 4924589 (1990-05-01), Leedy
patent: 4956602 (1990-09-01), Parrish
patent: 4961053 (1990-10-01), Krug
patent: 4968931 (1990-11-01), Littlebury et al.
patent: 4994735 (1991-02-01), Leedy
patent: 4996476 (1991-02-01), Balyasny et al.
patent: 5001422 (1991-03-01), Dahlberg et al.
patent: 5012187 (1991-04-01), Littlebury
patent: 5014161 (1991-05-01), Lee et al.
patent: 5020219 (1991-06-01), Leedy
patent: 5034685 (1991-07-01), Leedy
patent: 5034688 (1991-07-01), Moulene et al.
patent: 5053700 (1991-10-01), Parrish
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5089772 (1992-02-01), Hatada et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5123850 (1992-06-01), Elder et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5294776 (1994-03-01), Furuyama
patent: 5302891 (1994-04-01), Wood et al.
patent: 5315241 (1994-05-01), Ewers
patent: 5389556 (1995-02-01), Rostoker et al.
patent: 5399505 (1995-03-01), Dasse et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5532614 (1996-07-01), Chiu
patent: 5539324 (1996-07-01), Wood et al.
patent: 5663654 (1997-09-01), Wood et al.
patent: 5726580 (1998-03-01), Wood et al.
patent: 5859539 (1999-01-01), Wood et al.
patent: 5905382 (1999-05-01), Wood et al.
patent: 6087845 (2000-07-01), Wood et al.
patent: 6091254 (2000-07-01), Wood et al.
patent: 6342789 (2002-01-01), Wood et al.
patent: 6535012 (2003-03-01), Wood et al.
patent: 62-293629 (1987-12-01), None
Cloud et al., “Known-Good Die: A Key to Cost-Effective MCMs,” Electronic Packaging and Production, 2 pages, Sep. 1992.
“Known Good Die: Micron Technology That Works for You,” 2 pages, (month unavaliable) 1992.
Mills et al., “Decal Contactor with Decoder”, Research Disclosure, Jun. 1991, No. 326, 1 page.
Military Sram Die, Micron Military Products Data Book, (month unavailable) 1992, pp. 6-1 through 6-14.

Affiliated with

Also associated with

Rating

Method for testing using a universal wafer carrier for wafer... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for testing using a universal wafer carrier for wafer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for testing using a universal wafer carrier for wafer... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3547051