Mounting system for high-mass heatsinks

Details Mounting system for high-mass heatsinks Mounting system for high-mass heatsinks

2006-03-28

2006-03-28

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S740000, C029S744000, C029S757000, C029S760000, C029S832000, C257S718000, C257S727000, C361S704000, C361S719000

Reexamination Certificate

active

07017258

ABSTRACT:
A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The linkage assembly includes scoops, for grasping the pins during engagement, and a ratcheting system, for compressing the heatsink and thermal interface material onto the package. The mounting system is designed to effectively distribute the heatsink weight, as well as the forces caused by chronic and dynamic stresses, through, rather than upon the motherboard, such as to a chassis. The mounting system thus alleviates stress cracks, component pullout, solderball stress, and other damaging conditions to the motherboard. The mounting system may be engaged and disengaged without the use of tools.

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