Electrical contact and connector and method of manufacture

Electrical connectors – Including elastomeric or nonmetallic conductive portion

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S066000

Reexamination Certificate

active

07014479

ABSTRACT:
An electrical contact (2) and method of making the electrical contact (2), and a connector (11) and method making the connector (11), wherein the electrical contact (2) is an electrically conducting, nonwoven mesh (60), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (2), wherein the mesh (60) is annealed while restrained in the form of the electrical contact (2) wherein the mesh (60) is free of internal elastic strain, and wherein the connector (11) retains the electrical contact (2) for edgewise connection.

REFERENCES:
patent: 2153177 (1939-04-01), Ecker
patent: 3317885 (1967-05-01), Yost
patent: 3513434 (1970-05-01), Zielke
patent: 3634807 (1972-01-01), Grobe et al.
patent: 3639978 (1972-02-01), Schurman
patent: 3686926 (1972-08-01), Miller et al.
patent: 3795884 (1974-03-01), Kotaka
patent: 4029375 (1977-06-01), Gabrielian
patent: 4729739 (1988-03-01), Coffee et al.
patent: 4781640 (1988-11-01), Tornoe et al.
patent: 4810213 (1989-03-01), Chabot
patent: 4820376 (1989-04-01), Lambert et al.
patent: 4838815 (1989-06-01), Tajima et al.
patent: 4922376 (1990-05-01), Pommer et al.
patent: 5030109 (1991-07-01), Dery
patent: 5061191 (1991-10-01), Casciotti et al.
patent: 5101553 (1992-04-01), Carey et al.
patent: 5127837 (1992-07-01), Shah et al.
patent: 5176535 (1993-01-01), Redmond et al.
patent: 5215472 (1993-06-01), DelPrete et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5232372 (1993-08-01), Bradley et al.
patent: 5308252 (1994-05-01), Mroczkowski et al.
patent: 5350308 (1994-09-01), Laska et al.
patent: 5385477 (1995-01-01), Vaynkof et al.
patent: 5403194 (1995-04-01), Yamazaki
patent: 5427535 (1995-06-01), Sinclair
patent: 5441690 (1995-08-01), Ayala-Esquilin et al.
patent: 5473510 (1995-12-01), Dozier, II
patent: 5495397 (1996-02-01), Davidson et al.
patent: 5599193 (1997-02-01), Crotzer
patent: 5653598 (1997-08-01), Grabbe
patent: 5791914 (1998-08-01), Loranger et al.
patent: 5800184 (1998-09-01), Lopergolo et al.
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5810607 (1998-09-01), Shih et al.
patent: 5817986 (1998-10-01), Davidson et al.
patent: 5823792 (1998-10-01), Regnier
patent: 5833471 (1998-11-01), Selna
patent: 5949029 (1999-09-01), Crotzer et al.
patent: 6062870 (2000-05-01), Hopfer et al.
patent: 6074219 (2000-06-01), Tustaniwskyj et al.
patent: 6142789 (2000-11-01), Nolan et al.
patent: 6247938 (2001-06-01), Rathburn
patent: 6264476 (2001-07-01), Li et al.
patent: 6328080 (2001-12-01), Winters
patent: 6471554 (2002-10-01), Armistead et al.
patent: 6659778 (2003-12-01), Li
patent: 6716038 (2004-04-01), Garcia
patent: 2003/0073329 (2003-04-01), Beaman et al.
COSMOS Customer Successes; COSMOS helps analyze circuit board connectors; Internet pages; http://mcad.cosmosm.com/pages/successes/electronics7.html (4 pages).
Button Contacts for Liquid Nitrogen Applications; Frank Almquist; IBM Corporation; 0569-5503/89/0088, IEEE, pp 88-91.
A Novel Elestomeric Connector for Packaging Internconnections, Testing and Burn-In Applications; D. Y. Shih et al.; 0569-5503/95/0000-0126; 1995 IEEE; pp 126-133.
PC-nonlinear FEA makes the connection; Design News; Internet pages from www.designnews.com (4 pages); Dec. 23, 2004.
CIN::APSE High Speed Interconnect Technology; Brochure; 5 pages.
An Adaptable, High Performance LGA Connector Technology; HCD, Inc.; Dirk D. Brown et al.; 6 pages.
Two Fundamental Approaches to Enabling High Performance LGA Connections; HCD, Inc.; Dirk D. Brown et al.; pp 508-514.
Wafer-level CSP, Wafer-Level Asembly/test: Integrating Backend Processes; Solid State Technology; John Novitsky et al.; internet page http:solidstate.articles,printhis.clickability.com; 7 pages.
Z-Axis Interconnection for 3-D High Density Packaging; 2001 International Symposium on Microelectronics; S. Spicsshoefor et al.; pp 167-171.
HCD—High Connection Density, Inc. Corporate Overview; 6 pages.
Modular Subsystems and High Frequency Solutions; Connector and Socket Product Overview; HCD—High Connection Density, Inc.; Apr. 2004; 12 pages.
SuperButton Land Grid Array(LGA)Production IC Sockets; HCD—High Connection Density, Inc.; www.hcdcorp.com, 1 page.
Customable Multi-Contact-Point Interposer; IBM Technical Disclosure Bulletin; Apr. 1994; pp 105-106.
Special Thermal Conductive Interposers; IBM Technical Disclosure Bulletin; Sep. 1993; pp 7-8.
Passive Interposer Connection Scheme; IBM Technical Disclosure Bulletin; May 1993; pp 249-252.
Compressible-Contact Internconnection Scheme; IBM Technical Disclosure Bulletin; Oct. 1990; pp 394-395.
Improved Interconnection Structure; IBM Technical Disclosure Bulletin; Nov. 1988; pp 17-19.
Interposer Carrier; IBM Technical Disclosure Bulletin; Jan. 1987; pp 3678-3680.
Electrically Conductive Array in an Elastomeric Material; IBM Technical Disclosure Bulletin; Sep. 1982; pp 1801-1802.
High Density Area Array Connector; IBM Technical Disclosure Bulletin; Apr. 1991; pp 4-5.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrical contact and connector and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical contact and connector and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical contact and connector and method of manufacture will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3546207

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.