System and method for cooling electronic assemblies

Details System and method for cooling electronic assemblies System and method for cooling electronic assemblies

2006-03-14

2006-03-14

McKinnon, Terrell (Department: 3753)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S104330, C165S080400, C361S697000, C361S704000, C361S700000, C174S015200, C257S714000

Reexamination Certificate

active

07011144

ABSTRACT:
A cooling assembly is disclosed comprising one or more heat pipes heat pipes connected to a base member, a plurality of thermal plates connected to the one or more heat pipes at predefined intervals, wherein the one or more heat pipes intersects the plurality of thermal plates, and an opening fashioned in each one of the plurality of thermal plates.

REFERENCES:
patent: 5793611 (1998-08-01), Nakazato et al.
patent: 5959837 (1999-09-01), Yu
patent: 6102110 (2000-08-01), Julien et al.
patent: 6394175 (2002-05-01), Chen et al.
patent: 6625021 (2003-09-01), Lofland et al.
patent: 6651733 (2003-11-01), Horng et al.
patent: 6749011 (2004-06-01), Horng et al.
patent: 2003/0024687 (2003-02-01), Cheng et al.
patent: 2003/0094273 (2003-05-01), Toth et al.
patent: 2004/0182552 (2004-09-01), Kubo
patent: 2004/0200608 (2004-10-01), Baldassarre
patent: 11-54680 (1999-02-01), None
patent: 2003-283226 (2003-10-01), None

Affiliated with

Also associated with

Rating

System and method for cooling electronic assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for cooling electronic assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for cooling electronic assemblies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3545065