Polishing pad

Details Polishing pad Polishing pad

2006-07-11

2006-07-11

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S285000, C451S287000, C451S526000, C451S533000

Reexamination Certificate

active

07074115

ABSTRACT:
A polishing pad is useful planarizing semiconductor substrates. The polishing pad comprises a polymeric material having a porosity of at least 0.1 volume percent, a KEL energy loss factor at 40° C. and 1 rad/sec of 385 to 750 1/Pa and a modulus E′ at 40° C. and 1 rad/sec of 100 to 400 MPa.

REFERENCES:
patent: 6454634 (2002-09-01), James et al.
patent: 6477926 (2002-11-01), Swisher et al.
patent: 6910951 (2005-06-01), Balijepalli et al.
patent: 1 354 913 (2003-10-01), None
patent: 1 522 385 (2005-04-01), None
patent: WO 01/91971 (2001-12-01), None
patent: WO 03/066703 (2003-08-01), None
Uniroyal Chemical: “Adiprene LF 750D”, Product Data, Jul. 1996, XP002325260.

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