Molded electronic connector formed from a thermally...

Details Molded electronic connector formed from a thermally... Molded electronic connector formed from a thermally...

2006-01-03

2006-01-03

Prasad, Chandrika (Department: 2839)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C439S487000

Reexamination Certificate

active

06981805

ABSTRACT:
An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.

REFERENCES:
patent: 5129448 (1992-07-01), Holmberg, Jr. et al.
patent: 5230632 (1993-07-01), Baumberger et al.
patent: 5309320 (1994-05-01), Smith
patent: 5344795 (1994-09-01), Hashemi et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5424251 (1995-06-01), Sono et al.
patent: 5430609 (1995-07-01), Kikinis
patent: 5511138 (1996-04-01), Lebby et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5552960 (1996-09-01), Nelson et al.
patent: 5557500 (1996-09-01), Baucom et al.
patent: 5606341 (1997-02-01), Aguilera
patent: 5621613 (1997-04-01), Haley et al.
patent: 5646822 (1997-07-01), Bhatia et al.
patent: 5666261 (1997-09-01), Aguilera
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 5718282 (1998-02-01), Bhatia et al.
patent: 5764483 (1998-06-01), Ohashi et al.
patent: 5781409 (1998-07-01), Mecredy, III
patent: 5790376 (1998-08-01), Moore
patent: 5796581 (1998-08-01), Mok
patent: 5818693 (1998-10-01), Garner et al.
patent: 5822187 (1998-10-01), Garner et al.
patent: 5828552 (1998-10-01), Ma
patent: 5832987 (1998-11-01), Lowry et al.
patent: 5847938 (1998-12-01), Gammon
patent: 5980324 (1999-11-01), Berg et al.
patent: 6027256 (2000-02-01), Nightingale et al.
patent: 6162849 (2000-12-01), Zhuo et al.
patent: 6851869 (2005-02-01), Miller et al.

Affiliated with

Also associated with

Rating

Molded electronic connector formed from a thermally... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molded electronic connector formed from a thermally..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded electronic connector formed from a thermally... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3542363