Method for polishing organic film on semiconductor substrate...

Details Method for polishing organic film on semiconductor substrate... Method for polishing organic film on semiconductor substrate...

2006-05-02

2006-05-02

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S692000, C216S089000

Reexamination Certificate

active

07037839

ABSTRACT:
A method for polishing an organic film, comprising polishing an exposed organic film provided on a semiconductor substrate by use of slurry containing resin particles.

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Notification for filing Opinion (Office Action) for Korean Patent Application No. 10-2003-0068158, mailed Aug. 31, 2005 and English translation thereof.

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