Method of applying the analysis of scrub mark morphology and...

Details Method of applying the analysis of scrub mark morphology and... Method of applying the analysis of scrub mark morphology and...

2006-09-05

2006-09-05

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S758010, C382S151000

Reexamination Certificate

active

07102368

ABSTRACT:
By examining scrub mark properties (such as position and size) directly, the performance of a wafer probing process may be evaluated. Scrub mark images are captured, image data measured, and detailed information about the process is extracted through analysis. The information may then be used to troubleshoot, improve, and monitor the probing process.

REFERENCES:
patent: 5657394 (1997-08-01), Schwartz et al.

Affiliated with

Also associated with

Rating

Method of applying the analysis of scrub mark morphology and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of applying the analysis of scrub mark morphology and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of applying the analysis of scrub mark morphology and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3542030