Mounting with auxiliary bumps

Details Mounting with auxiliary bumps Mounting with auxiliary bumps

2006-09-19

2006-09-19

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257SE21515

Reexamination Certificate

active

07109583

ABSTRACT:
An electronic circuit can be produced by placing an electrically conductive compressible circuit bump on a circuit electrode of a mounting surface of first and second circuit devices, such as an integrated circuit and a base substrate. One or more auxiliary bumps can also be placed on one or both of the mounting surfaces of the circuit devices. During mounting, the first circuit device can be positioned over the second circuit device with the circuit bumps connecting circuit contacts on the two mounting surfaces. Pressure can be applied so that the circuit bumps and the auxiliary bumps are compressed between the chip and the base device sufficiently for adhering at least the circuit bumps to the circuit contacts.

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