Thermal processing apparatus and thermal processing method

Details Thermal processing apparatus and thermal processing method Thermal processing apparatus and thermal processing method

2006-05-02

2006-05-02

Fuqua, Shawntina (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S405000, C219S411000, C392S416000, C392S418000, C118S724000, C118S725000, C118S050100

Reexamination Certificate

active

07038173

ABSTRACT:
A thermal processing apparatus, performing processing accompanied with heating on a substrate, having an upper lamp group directed toward a prescribed direction and a lower lamp group perpendicularly intersecting with the upper lamp group is provided with a lower reflector between the upper and lower lamp groups. The lower reflector is so provided as to reflect light from lamps, included in the lower lamp group, present on both end regions in relation to the direction of arrangement. Thus, the thermal processing apparatus can efficiently irradiate an auxiliary ring with reflected light from the lower lamp group and improve temperature uniformity when heating the substrate.

REFERENCES:
patent: 4680451 (1987-07-01), Gat et al.
patent: 5951896 (1999-09-01), Mahawili
patent: 6437290 (2002-08-01), Shao et al.
patent: 6570134 (2003-05-01), Suzuki et al.
patent: 2000182982 (2000-06-01), None
patent: 2001210604 (2001-08-01), None
English translation of Abstract of Japanese Application Laid-Open No. 2001-210604.
English translation of Abstract of Japanese Application Laid-Open No. 2000-182982.

Affiliated with

Also associated with

Rating

Thermal processing apparatus and thermal processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal processing apparatus and thermal processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal processing apparatus and thermal processing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3538673