Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices
Reexamination Certificate
2006-09-12
2006-09-12
Nguyen, Kiet T. (Department: 2881)
Radiant energy
Irradiation of objects or material
Irradiation of semiconductor devices
C700S057000, C716S030000, C716S030000, C430S394000
Reexamination Certificate
active
07105841
ABSTRACT:
The present subject matter allows non-orthogonal lines to be formed at the same thickness as the orthogonal lines so as to promote compact designs, to be formed with even line edges, and to be formed efficiently. One aspect of the present subject matter relates to a method for forming non-orthogonal images in a raster-based photolithographic system. According to various embodiments of the method, a first image corresponding to a first data set is formed on a reticle when the reticle is at a first rotational position θ1. The reticle is adjusted to a second rotational position θ2. A second image corresponding to a second data set is formed on the reticle when the reticle is at the second rotational position θ2. The second image is non-orthogonal with respect to the first image. Other aspects are provided herein.
REFERENCES:
patent: 4310743 (1982-01-01), Seliger
patent: 4465934 (1984-08-01), Westerberg et al.
patent: 4748478 (1988-05-01), Suwa et al.
patent: 4758863 (1988-07-01), Nikkel
patent: 4769523 (1988-09-01), Tanimoto et al.
patent: 5251140 (1993-10-01), Chung et al.
patent: 5446649 (1995-08-01), Keum
patent: 5627624 (1997-05-01), Yim et al.
patent: 5671173 (1997-09-01), Tomita
patent: 5792569 (1998-08-01), Sun et al.
patent: 5821592 (1998-10-01), Hoenigschmid et al.
patent: 6178131 (2001-01-01), Ishikawa et al.
patent: 6215128 (2001-04-01), Mankos et al.
patent: 6238850 (2001-05-01), Bula et al.
patent: 6282113 (2001-08-01), DeBrosse
patent: 6296977 (2001-10-01), Kaise et al.
patent: 6410948 (2002-06-01), Tran et al.
patent: 6426269 (2002-07-01), Haffner et al.
patent: 6448591 (2002-09-01), Juengling
patent: 6510080 (2003-01-01), Farrar
patent: 6522579 (2003-02-01), Hoenigschmid
patent: 6581198 (2003-06-01), Teig et al.
patent: 6607944 (2003-08-01), Tran et al.
patent: 6645842 (2003-11-01), Igarashi et al.
patent: 6671864 (2003-12-01), Teig et al.
patent: 6678872 (2004-01-01), Teig et al.
patent: 6710850 (2004-03-01), Yamaguchi et al.
patent: 6711727 (2004-03-01), Teig et al.
patent: 6745379 (2004-06-01), Teig et al.
patent: 6767674 (2004-07-01), Carpi
patent: 6769105 (2004-07-01), Teig et al.
patent: 6854101 (2005-02-01), Teig et al.
patent: 6892371 (2005-05-01), Teig et al.
patent: 6895567 (2005-05-01), Teig et al.
patent: 6898773 (2005-05-01), Teig et al.
patent: 2004/0098696 (2004-05-01), Teig et al.
patent: 2004/0103387 (2004-05-01), Teig et al.
patent: 2004/0243960 (2004-12-01), Hsu et al.
patent: 2005/0026086 (2005-02-01), Farrar
patent: 2005/0030513 (2005-02-01), Farrar
patent: 2005/0048741 (2005-03-01), Phan et al.
patent: 2005/0091619 (2005-04-01), Teig et al.
patent: 2005/0280150 (2005-12-01), Farrar
“X Architecture—Sleek, Fast . . . Not Your Father's Chip”,Semiconductor Magazine,2(8), (Aug. 2001), 3 pages.
EE Times Online, “RISC processor employs diagonal interconnects”,EE Times Online,http://www.eetimes.com/showArticle.jhtml?articleID=10803033, (Feb. 6, 2002), 1 page.
EETimes Online, “Diagonal IC interconnects vs. right-angle grids will boost complex designs, says group”,EETimes Online,(Jun. 4, 2001), 2 pages.
Fujimura, Aki , “Simplex—X Architecture Design Data”, Presented at the Oct. 11, 2001 X Architecture Open Forum, (2001), 9 pages.
Fujimura, Aki , “X Architecture Benefits”, X Architecture Open Forum at the Design Automation Conference in New Orleans, (Jun. 2002), 10 pages.
Gillette-Martin, Lisa , “Technology Innovations Reshape Industry”,The Inside Line,1(1), (Jul. 16, 2001), 1 page.
Hand, Aaron , “X Architecture Gets Lithographic Verification”,Semiconductor International,(Jun. 1, 2002), 2 pages.
Igarashi, Mutsunori , et al., “A Diagonal-Interconnect Architecture and its Application to RISC Core Design”,ISSCC 2002/Session 12,(2002), 4 pages.
Mitsuhashi, Takashi , et al., “Performance-Oriented Layout Design”,Design Wave Magazine,(Sep. 2001), 59-64.
Montalti, Marco , “X Initiative”, X Architecture Open Forum at the Design Automation Conference in New Orleans, (Jun. 2002), 4 pages.
Morrison, Gale , “X Marks the Spot”,Electronic News,(Jun. 6, 2001), 2 pages.
Nickolas, Christina , “Chip architecture reduces interconnect length”,Electronic Products,(Aug. 2001), 2 pages.
Rowen, Chris , “X and Processors”, X Architecture Open Forum at the Design Automation Conference in New Orleans, (Jun. 11, 2002), 4 pages.
Rygler, Ken , “Motivation for X”, X Architecture Open Forum at the Design Automation Conference in New Orleans, (Jun. 2002), 7 pages.
Song, Li , “Investigating a Lithography Strategy for Diagonal Routing Architecture at Sub-100nm Technology Nodes”,Data Analysis and Modeling for Process Control II.Edited by Emami, Iraj.Proceedings of the SPIE,vol. 5756, (2005), 368-377.
Takigawa, Tadahiro , et al., “The Road to X Success: Toshiba Machine Equipment Support”,Power Point Presentation,(2001), 13 pages.
Teig, Steven L., “The X architecture: not your father's diagonal wiring”, Proceedings of the 2002 international workshop on System-level interconnect prediction, (2002), 33-37.
Nguyen Kiet T.
Schwegman Lundberg Woessner & Kluth P.A.
LandOfFree
Photolithographic techniques for producing angled lines does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photolithographic techniques for producing angled lines, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photolithographic techniques for producing angled lines will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3538237