Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-01-03
2006-01-03
Thai, Luan (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000, C257S659000, C361S704000
Reexamination Certificate
active
06982481
ABSTRACT:
Described is an apparatus for dissipating heat and shielding electromagnetic radiation from at least one electronic device on a printed circuit board. The apparatus includes a printed circuit board with a surface, at least one integrated circuit on the surface, and an electrically conductive region surrounding the at least one integrated circuit. The apparatus also includes an electrically conductive cover portion. The electrically conductive cover portion has a top surface and a bottom edge, and defines a cavity. The top surface has at least one heat-dissipating structure that extends from it. The bottom edge is in electrically conductive contact with the electrically conductive region of the printed circuit board. The cavity encloses the at least one integrated circuit on the surface of the printed circuit board to shield electromagnetic radiation. The at least one integrated circuit is in thermally conductive communication with the electrically conductive cover portion. Heat generated by the at least one integrated circuit is transferred to the electrically conductive cover portion from which the heat is dissipated by the at least one heat-dissipating structure.
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Mistry Balwantrai
Sonderegger Mark
Guerin & Rodriguez LLP
Nortel Networks Limited
Rodriguez Michael A.
Thai Luan
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