Process for producing high speed transmitting dielectric...

Details Process for producing high speed transmitting dielectric... Process for producing high speed transmitting dielectric...

2006-09-05

2006-09-05

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S396000

Reexamination Certificate

active

07101933

ABSTRACT:
A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the type of low bromine content in a non-polar solvent in the presence of a catalyst in a reactor at a temperature of 90° C. to 220° C., characterized in that, in the course of the reaction, PPE needs not to be cleaved into small molecules and in stead, can mix and react directly with the epoxy resin to thereby produce a high speed transmitting dielectric material. The process of the invention can reduce greatly the synthetic reaction time, and is applicable in the production of the material useful in printed circuit board for wireless communication, base station and the like.

REFERENCES:
patent: 5043367 (1991-08-01), Hallgren et al.
patent: 5262491 (1993-11-01), Jain et al.
patent: 5821305 (1998-10-01), Schutyser et al.
patent: 5834565 (1998-11-01), Tracy et al.
patent: 6387990 (2002-05-01), Yeager
patent: 7022777 (2006-04-01), Davis et al.
patent: 5-25451 (1993-02-01), None
patent: 9-202850 (1997-08-01), None

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