Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-01-24
2006-01-24
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S730000, C257S772000, C257S779000, C257S780000, C361S772000, C361S774000
Reexamination Certificate
active
06989591
ABSTRACT:
The invention relates to a method for making an integrated circuit (40) of the surface-mount type the comprising, first of all, manufacture of a package having a rear face and a pin grid array extending under this rear face perpendicular thereto, and a ball (44) of low melting point alloy is then formed at the end of each pin surrounding this end and soldered thereto.The invention also relates to an integrated circuit (40) of the surface-mount type, comprising a package having a rear face and a pin grid array, of a cross section roughly constant along the pin (42), extending under the rear face perpendicular thereto. A ball (44) of low melting point alloy is soldered to the end of each pin (42) surrounding this end.
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Atmel Grenoble S.A.
Chambliss Alonzo
Lowe Hauptman & Berner LLP
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