Inkjet printhead with ink chamber inlet etched into wafer

Details Inkjet printhead with ink chamber inlet etched into wafer Inkjet printhead with ink chamber inlet etched into wafer

2006-07-18

2006-07-18

Hsieh, Shih-Wen (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S047000, C347S048000

Reexamination Certificate

active

07077493

ABSTRACT:
An inkjet printhead with nozzles4and liquid passages31, 32leading to each nozzle. The nozzles, ejection actuators14, associated drive circuitry22and liquid passage31, 32being formed on and through a wafer21using lithographically masked etching technique, such that the wafer has a droplet ejection side and a liquid supply side. Each of the liquid passages is formed by etching a hole31partially through the wafer21from the droplet ejection side, and etching a passage from the liquid supply side of the wafer21to the hole31. Etching a hole31into the wafer21from the droplet ejection side means the ink supply passage32can stop short of the interface between the dielectric23and the wafer21to prevent the etchant from tracking sideways and damaging the drive circuitry22. As the hole etched from the ejection side is relatively shallow, the removal of the resist is not overly difficult. This permits a more compact overall design and higher nozzle packing density.

REFERENCES:
patent: 6364453 (2002-04-01), Silverbrook
patent: 6425651 (2002-07-01), Silverbrook
patent: 6536874 (2003-03-01), Silverbrook
patent: WO 00/23279 (2000-04-01), None
U.S. Appl. No. 10/728,783, filed Dec. 8, 2003, Silverbrook.

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