Planarizing process

Details Planarizing process Planarizing process

2006-05-23

2006-05-23

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S603120, C029S603140, C029S603150, C029S603180, C360S121000, C360S122000, C360S125330, C360S317000, C427S127000, C427S128000, C451S004000, C451S051000

Reexamination Certificate

active

07047625

ABSTRACT:
Present processes used for planarizing a cavity filled with a coil and hard baked photoresist require that a significant amount of the thickness of the coils be removed. This increases the DC resistance of the coil. In the present invention, cavity and coil are overfilled with photoresist which is then hard baked. A layer of alumina is then deposited onto the surface of the excess photoresist, following which CMP is initiated. The presence of the alumina serves to stabilize the photoresist so that it does not delaminate. CMP is terminated as soon as the coils are exposed, allowing their full thickness to be retained and resulting in minimum DC resistance.

REFERENCES:
patent: 5779923 (1998-07-01), Krounbi et al.
patent: 6317288 (2001-11-01), Sasaki
patent: 6339523 (2002-01-01), Santini
patent: 6396660 (2002-05-01), Jensen et al.
patent: 6466401 (2002-10-01), Hong et al.
patent: 6466404 (2002-10-01), Crue, Jr. et al.
patent: 6687083 (2004-02-01), Hsiao et al.
patent: 6693769 (2004-02-01), Hsu et al.
patent: 2005/0024769 (2005-02-01), Han et al.
patent: 01256107 (1989-10-01), None
“Design and performance of a recessed thin film inductive transducer”; Zak, B.S.; Curland, N.; Giusti, J.H.; Ash, K.P.; Cameron, G.P.; Magnetics, IEEE Transactions on vol. 32, Issue 1, Jan. 1996; pp.: 74-79.

Affiliated with

Also associated with

Rating

Planarizing process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Planarizing process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Planarizing process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3536188