Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-05-09
2006-05-09
Thompson, Craig A. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S125000, C264S401000
Reexamination Certificate
active
07041533
ABSTRACT:
One or more stabilizers are disposed on the surface of a semiconductor device component prior to bonding the same to a higher-level substrate. Upon assembly of the semiconductor device component face-down upon a higher-level substrate and joining conductive structures between the contact pads of the semiconductor device component and corresponding contact pads of the higher-level substrate, the stabilizers at least partially stabilize the semiconductor device component on the higher-level substrate to maintain a substantially parallel relation therebetween. The stabilizers can also be positioned and configured to define a minimum, substantially uniform distance between the semiconductor device component and the higher-level substrate. The stabilizers may be preformed structures or fabricated on the surface of the semiconductor device component, such as by way of a stereolithographic method.
REFERENCES:
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 4575330 (1986-03-01), Hull
patent: 5056215 (1991-10-01), Blanton
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5220200 (1993-06-01), Blanton
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5278442 (1994-01-01), Prinz et al.
patent: 5484314 (1996-01-01), Farnworth
patent: 5639696 (1997-06-01), Liang et al.
patent: 5700715 (1997-12-01), Pasch
patent: 5705117 (1998-01-01), O'Connor et al.
patent: 5870220 (1999-02-01), Migdal et al.
patent: 6046910 (2000-04-01), Ghaem et al.
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6271598 (2001-08-01), Vindasius et al.
patent: 6287895 (2001-09-01), Sato
patent: 6326698 (2001-12-01), Akram
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6410366 (2002-06-01), Hashimoto
patent: 6461881 (2002-10-01), Farnworth et al.
patent: 6506671 (2003-01-01), Grigg
patent: 6524346 (2003-02-01), Farnworth
patent: 6525408 (2003-02-01), Akram et al.
patent: 6529027 (2003-03-01), Akram et al.
patent: 6531335 (2003-03-01), Grigg
patent: 6544821 (2003-04-01), Akram
patent: 6548897 (2003-04-01), Grigg
patent: 6549821 (2003-04-01), Farnworth et al.
patent: 6569753 (2003-05-01), Akram et al.
patent: 6630365 (2003-10-01), Farnworth et al.
patent: 6649444 (2003-11-01), Earnworth et al.
patent: 6740962 (2004-05-01), Grigg
patent: 2002/0105074 (2002-08-01), Akram et al.
patent: 2002/0171177 (2002-11-01), Kritchman et al.
patent: 2003/0022462 (2003-01-01), Farnworth et al.
patent: 2003/0089999 (2003-05-01), Akram
patent: 2003/0092220 (2003-05-01), Akram
patent: 2003/0098499 (2003-05-01), Akram et al.
patent: 2003/0139030 (2003-07-01), Grigg
patent: 2003/0151167 (2003-08-01), Kritchman et al.
patent: 2003/0170921 (2003-09-01), Akram
patent: 2003/0173665 (2003-09-01), Grigg
patent: 2003/0176016 (2003-09-01), Grigg
patent: 2003/0203612 (2003-10-01), Akram et al.
patent: 2004/0047539 (2004-03-01), Okubora et al.
patent: 463297 (1991-03-01), None
patent: 57-176738 (1982-10-01), None
patent: 58-157146 (1983-09-01), None
patent: 1-238148 (1989-09-01), None
patent: 4-37137 (1992-02-01), None
patent: 4-62866 (1992-02-01), None
patent: 10189653 (1998-07-01), None
patent: 11-40608 (1999-02-01), None
patent: 11-214432 (1999-08-01), None
patent: 2000-77458 (2000-03-01), None
patent: 2000-299330 (2000-10-01), None
Miller et al., “Maskless Mesoscale Materials Deposition”, Deposition Technology, Sep. 2001, pp. 20-22.
Miller, “New Laser-Directed Deposition Technology”, Microelectronic Fabrication, Aug. 2001, p. 16.
Webpage, Objet Prototyping the Future, Objet FullCure700 Series, 1 page.
Webpage, Objet Prototyping the Future, How it Works, 2 pages.
U.S. Appl. No. 09/590,527, filed Jun. 8, 2000, entitled “Structures For Stabilizing Semiconductor Devices Relative to Test Substrates and Methods for Fabricating the Stabilizers”, inventor Salman Akram.
U.S. Appl. No. 10/201,208, filed Jul. 22, 2002, entitled “Thick Solder Mask for Confining Encapsulant Material Over Selected Locations of a Substrate, Assemblies Including the Solder Mask, and Methods”, inventor Grigg et al.
U.S. Appl. No. 10/688,354, filed Oct. 17, 2003, entitled “Thick Solder Mask for Confining Encapsulant Material Over Selected Locations of a Substrate and Assemblies Including the Solder Mask”, inventor Grigg et al.
Ahmad Syed Sajid
Akram Salman
Berezny Nema
Thompson Craig A.
LandOfFree
Stereolithographic method for fabricating stabilizers for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stereolithographic method for fabricating stabilizers for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stereolithographic method for fabricating stabilizers for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3535712