Solder printing using a stencil having a reverse-tapered...

Details Solder printing using a stencil having a reverse-tapered... Solder printing using a stencil having a reverse-tapered...

2006-01-24

2006-01-24

Edmondson, L. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S039000, C228S041000, C228S180220, C118S504000, C118S721000

Reexamination Certificate

active

06988652

ABSTRACT:
A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board).

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