Semiconductor device for fingerprint recognition

Details Semiconductor device for fingerprint recognition Semiconductor device for fingerprint recognition

2006-03-21

2006-03-21

Tran, Mai-Huong (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C361S783000, C361S820000, C257S433000, C257S434000, C257S680000, C257S681000, C257S704000

Reexamination Certificate

active

07015579

ABSTRACT:
A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

REFERENCES:
patent: 5949655 (1999-09-01), Glenn
patent: 9-289268 (1997-11-01), None
patent: 2002-516439 (2002-06-01), None

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