Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-03-21
2006-03-21
Prenty, Mark V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000
Reexamination Certificate
active
07015578
ABSTRACT:
A semiconductor unit has semiconductor modules and cooling members. The semiconductor module includes power devices with a flat shape, the first electrode bonded to the first device surface, the second electrode bonded to the second device surface, the first terminals connecting to a device control circuit, the second terminals connecting to a device driving circuit, and mold resin unifying the devices, the first electrode, the second electrode, the first terminals, and the second terminals in a unit. The mold resin is so formed that the first electrode face and second electrode face are exposed. The cooling members sandwich the semiconductor modules through insulating members. The semiconductor unit has the first electrode face of the first electrode coplanar with the first resin face of the mold resin, and/or the second electrode face of the second electrode coplanar with the second resin face of the mold resin.
REFERENCES:
patent: 6542365 (2003-04-01), Inoue
patent: 2005/0012206 (2005-01-01), Nakamura et al.
patent: A 2001-308263 (2001-11-01), None
patent: A 2001-320005 (2001-11-01), None
patent: A 2002-095267 (2002-03-01), None
Ishiyama Hiroshi
Nakamura Shigenobu
Sakai Yasuyuki
Denso Corporation
Prenty Mark V.
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