Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2006-09-26
2006-09-26
Vinh, Lan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S649000, C438S651000, C438S720000
Reexamination Certificate
active
07112535
ABSTRACT:
A process is disclosed for fabricating precision polysilicon resistors which more precisely control the tolerance of the sheet resistivity of the produced polysilicon resistors. The process generally includes performing an emitter/FET activation rapid thermal anneal (RTA) on a wafer having partially formed polysilicon resistors, followed by steps of depositing a protective dielectric layer on the polysilicon, implanting a dopant through the protective dielectric layer into the polysilicon to define the resistance of the polysilicon resistors, and forming a silicide.
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Coolbaugh Douglas D.
Greer Heidi L.
Rassel Robert M.
International Business Machines - Corporation
Sabo, Esq. William D.
Scully , Scott, Murphy & Presser, P.C.
Vinh Lan
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