Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-07-11
2006-07-11
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S331400, C156S331700, C525S440030, C525S457000
Reexamination Certificate
active
07074297
ABSTRACT:
A method for forming an isocyanate-functional moisture reactive hot melt adhesive by first forming a hydroxyl-functional prepolymer from a polyol selected from the group including polyester polyols, polyether polyols, and mixtures thereof and a polyisocyanate and subsequently forming the moisture reactive hot melt adhesive from the hydroxyl-functional prepolymer, a polyol selected from the group including polyester polyols, polyether polyols, and a polyisocyanate is provided. An isocyanate-functional moisture reactive hot melt adhesive formed by the method of the present invention and a method for bonding substrates are also provided.
REFERENCES:
patent: 4408008 (1983-10-01), Markusch
patent: 4814373 (1989-03-01), Frankel et al.
patent: 4891269 (1990-01-01), Markevka et al.
patent: 5155180 (1992-10-01), Takada et al.
patent: 5162457 (1992-11-01), Hansel et al.
patent: 5194487 (1993-03-01), Jacobs
patent: 5441808 (1995-08-01), Anderson et al.
patent: 5668222 (1997-09-01), McKinley et al.
patent: 5939499 (1999-08-01), Anderson et al.
patent: 6365700 (2002-04-01), Graham
patent: WO 91/15530 (1991-10-01), None
patent: WO 00/75209 (2000-12-01), None
Aftergut Jeff H.
Falk Stephen T.
Goff John L.
Rohm and Haas Company
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