Customized polishing pad for selective process performance...

Details Customized polishing pad for selective process performance... Customized polishing pad for selective process performance...

2006-03-28

2006-03-28

Rachuba, M. (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S530000, C451S533000, C451S539000

Reexamination Certificate

active

07018282

ABSTRACT:
The present invention comprises a customized polishing pad for use in a wafer polishing machine. The polishing pad of the present invention includes a polishing surface integral with the polishing pad. The polishing surface is adapted to frictionally contact a wafer in the polishing machine, thereby polishing the wafer. The polishing surface of the polishing pad includes at least two areas, where each area is adapted to frictionally contact the wafer and achieve a polishing effect specific for that area. A customized polishing effect is achieved by the polishing pad of the present invention when the wafer is selectively moved frictionally against the at least two areas by the wafer polishing machine.

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patent: 5609517 (1997-03-01), Lofaro
patent: 5664989 (1997-09-01), Nakata et al.

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