Wafer handling system

Material or article handling – Apparatus for moving material between zones having different...

Reexamination Certificate

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Details

C414S292000

Reexamination Certificate

active

06981832

ABSTRACT:
A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300-mm wafers. The system is configured initially for handling standard 300-mm FOUP cassettes. Adaptions for handling 200-mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300-mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.

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SEMI E62-0997 “Provisional Specification for 300-mm Front-Opening Interface Mechanical Standard (FIMS)” [FOUP Standard] (1997).

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