Process for manufacturing semiconductor device

Details Process for manufacturing semiconductor device Process for manufacturing semiconductor device

2006-04-25

2006-04-25

Nguyen, Cuong (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000

Reexamination Certificate

active

07033860

ABSTRACT:
A process for manufacturing a semiconductor device, the process comprising the steps of: covering an electrode terminal forming surface of a semiconductor wafer, on which a plurality of semiconductor elements are formed and arranged, with a cover layer comprising a flexible insulating film on which re-wiring patterns are formed, to adhere the cover layer to the electrode terminal forming surface, in such a manner that electrode terminals of the semiconductor elements are electrically connected with connecting terminals of the re-wiring patterns; forming the semiconductor wafer with grooves from the surface opposite to the electrode terminal forming surface thereof, so that the grooves extend along boundary lines of the semiconductor elements; dividing the semiconductor wafer with the cover layer to obtain a plurality of units, each unit comprising a plurality of the semiconductor elements and a sub-divided cover layer to define a single semiconductor device; and folding the cover layer of the respective divided unit along the grooves, so that at least some of the semiconductor elements in the respective unit are stacked.

REFERENCES:
patent: 6225688 (2001-05-01), Kim et al.
patent: 6884653 (2005-04-01), Larson
patent: 6940158 (2005-09-01), Haba et al.
patent: 2000-307037 (2000-11-01), None
patent: 2003-86760 (2003-03-01), None
patent: 2003-86761 (2003-03-01), None

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