Method of reforming reformable members of an electronic...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S874000, C029S878000, C228S180210

Reexamination Certificate

active

06978542

ABSTRACT:
An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.

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patent: 5730606 (1998-03-01), Sinclair
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5984694 (1999-11-01), Sinclair
patent: 6202297 (2001-03-01), Faraci et al.
patent: 6286205 (2001-09-01), Faraci et al.

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