Potted electrical components and methods of making the same

Details Potted electrical components and methods of making the same Potted electrical components and methods of making the same

1993-09-24

1996-06-11

Seidleck, James J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Cellular products or processes of preparing a cellular...

174 522, 174 523, 174110F, 174110SR, 264 464, 428 365, 4283084, 4283184, 4283191, 4284735, 521183, 521185, 521187, 521189, 521157, C08G 6344

Patent

active

055256449

ABSTRACT:
This invention relates to an article comprising a potted electrical component in a structure, wherein the electrical component is potted in a polyimide composition. The invention also relates to a method of potting electrical components comprising the steps of (1) adding a polyimide precursor to a structure including an electrical component, (2) curing the polyimide precursor to form a polyimide composition encapsulating the electrical component.

REFERENCES:
patent: 3607387 (1971-09-01), Lanza et al.
patent: 3824328 (1974-07-01), Ting et al.
patent: 4094862 (1978-06-01), Bell
patent: 4183839 (1980-01-01), Gagliani
patent: 4305796 (1981-12-01), Gagliani et al.
patent: 4369261 (1983-01-01), Gagliani et al.
patent: 4439381 (1984-03-01), Gagliani et al.
patent: 4440883 (1984-04-01), Pammer
patent: 4525507 (1985-06-01), Chaker et al.
patent: 4532263 (1985-07-01), Krutchen et al.
patent: 4677528 (1987-06-01), Miniet et al.
patent: 4725693 (1988-02-01), Hirsch
patent: 4822870 (1989-04-01), Restaino
patent: 4898763 (1990-02-01), Ferro
patent: 4933375 (1990-06-01), Shulman
patent: 4992059 (1991-02-01), King et al.
patent: 4999419 (1991-03-01), Restaino
patent: 5077318 (1991-12-01), Barringer et al.
patent: 5096932 (1992-03-01), Barringer et al.
patent: 5153234 (1992-10-01), Loy et al.
patent: 5248519 (1993-09-01), Stoakley et al.
JP-A-62 123 724, Hitachi Ltd., Semiconductor Device Provided With Comparatively Thick Synthetic Resin Protective Coat, Jun. 5, 1987.
EP-A-0 373 402, General Electric Company, Expandable Polyetherimide Resins, Jun. 20, 1990.
EP 93 30 7212, European Search Report mailed May 24, 1994.
JP-A-62 069 650, Hitachi Ltd., Semiconductor Device, Mar. 30, 1987.
JP-A-02 137 248, Nec Corp., Resin-Sealed Semiconductor Device, May 25, 1990.
JP-A-01 238 150, Fujitsu Ltd., Semiconductor Device, Sep. 22, 1989.

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