Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-06-14
2005-06-14
Nguyen, Thanh (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S781000, C257S784000, C257S786000
Reexamination Certificate
active
06906418
ABSTRACT:
A semiconductor component includes a die having a pattern of die contacts, and interconnect contacts bonded to the die contacts and encapsulated in an insulating layer. The component also includes terminal contacts formed on tip portions of the interconnect contacts. Alternately the component can include conductors and bonding pads in electrical communication with the interconnect contacts configured to redistribute the pattern of the die contacts. A method for fabricating the component includes the steps of forming the interconnect contacts on the die contacts, and forming the insulating layer on the interconnect contacts while leaving the tip portions exposed. The method also includes the step of forming the terminal contacts on the interconnect contacts, or alternately forming the conductors and bonding pads in electrical communication with the interconnect contacts and then forming the terminal contacts on the bonding pads.
REFERENCES:
patent: 5908317 (1999-06-01), Heo
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6091141 (2000-07-01), Heo
patent: 6118179 (2000-09-01), Farnworth et al.
patent: 6180504 (2001-01-01), Farnworth et al.
patent: 6252301 (2001-06-01), Gilleo et al.
patent: 6303997 (2001-10-01), Lee
patent: 6331737 (2001-12-01), Lim et al.
patent: 6365439 (2002-04-01), Miyazaki et al.
patent: 6368896 (2002-04-01), Farnworth et al.
patent: 6369454 (2002-04-01), Chung
patent: 6400172 (2002-06-01), Farnworth et al.
patent: 6429675 (2002-08-01), Bell
patent: 6465877 (2002-10-01), Farnworth et al.
patent: 6476503 (2002-11-01), Imamura et al.
patent: 6620731 (2003-09-01), Farnworth et al.
patent: 6803303 (2004-10-01), Hiatt et al.
Farnworth Warren M.
Hiatt William M.
Sinha Nishant
Watkins Charles M.
Gratton Stephen A.
Nguyen Thanh
LandOfFree
Semiconductor component having encapsulated, bonded,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor component having encapsulated, bonded,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor component having encapsulated, bonded,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3519876