Side braze packages

Details Side braze packages Side braze packages

2005-06-07

2005-06-07

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S777000

Reexamination Certificate

active

06903455

ABSTRACT:
Side braze packages for semiconductor devices are disclosed. A disclosed side braze package includes a lead located at a sidewall of a main body having a groove. A first semiconductor chip is flip chip bonded on the groove through a solder bump. A second semiconductor chip is stacked on the first semiconductor chip. A first through hole is formed from an upper portion of the main body to a lower portion of the main body around an inner sidewall of the groove. A first line is connected to the lead through the solder bump and the first through hole. A second line is connected to the lead through the first through hole. A wire interconnects a pad of the second semiconductor to the second line.

REFERENCES:
patent: 6380631 (2002-04-01), Mess et al.

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