Three-dimensional nonwoven substrate for circuit board

Details Three-dimensional nonwoven substrate for circuit board Three-dimensional nonwoven substrate for circuit board

2005-11-15

2005-11-15

McDowell, Suzanne E. (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Making hole or aperture in article

C264S171240, C264S284000, C156S158000, C427S096400, C442S408000, C028S104000

Reexamination Certificate

active

06964749

ABSTRACT:
The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application.By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.

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