Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate
2005-06-07
2005-06-07
Dixon, Merrick (Department: 1774)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
C156S509000, C156S508000, C156S458000, C156S495000, C156S406400, C156S390000, C156S442200
Reexamination Certificate
active
06901986
ABSTRACT:
The present invention involves a carbon fiber-filled sheet molding compound and method of manufacturing the same. The invention comprises providing chopped automotive carbon fibers, a predetermined resin paste, a first carrier film, and a second carrier film. The method further involves coating substantially completely one side of one of the first and second carrier films with the predetermined resin paste to define a coated side, depositing the chopped automotive carbon fibers onto the coated side, and covering the deposited carbon fibers with the second carrier film to define a compactible carbon-filled laminate. The method further includes compacting the carbon-filled laminate to admix the resin paste with the carbon fibers between the films, whereby to form the automotive carbon fiber-filled sheet molding compound.
REFERENCES:
patent: 3778334 (1973-12-01), Sturgeon
patent: 4992127 (1991-02-01), Kishi et al.
patent: 5484652 (1996-01-01), Strunk et al.
patent: 5599599 (1997-02-01), Mirmiran et al.
patent: 0 122 024 (1984-10-01), None
Brooks & Kushman P.C.
Dixon Merrick
Patent Holding Company
LandOfFree
Carbon fiber-filled sheet molding compound and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Carbon fiber-filled sheet molding compound and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carbon fiber-filled sheet molding compound and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3518408