Molding apparatus for molding semiconductor devices in which...

Details Molding apparatus for molding semiconductor devices in which... Molding apparatus for molding semiconductor devices in which...

2005-12-06

2005-12-06

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

C425S126100, C425S225000, C264S039000, C264S272170

Reexamination Certificate

active

06971863

ABSTRACT:
A molding apparatus for molding semiconductor devices using a molding compound in which a mold is automatically treated with a mold releasing agent is provided. A lead frame strip in-magazine part and a tablet loading part are designed so that dummy lead frame strips and releasing tablets used in a mold releasing agent treatment process are automatically supplied to the molding apparatus in a mold releasing agent treatment mode or a mold cleaning mode. After the mold releasing agent treatment mode or mold cleaning mode is complete, the molding apparatus is switched back to a normal molding process and normal lead frame strips and molding compound tablets are to the mold part. In addition, a pick-up part and a stack magazine part are designed to distinguish by-products generated during the mold releasing agent treatment process from normally molded products by switching from a normal molding process to either a mold releasing agent treatment process or a mold cleaning process.

REFERENCES:
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patent: 5770128 (1998-06-01), Kobayashi et al.
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patent: 2001300978 (2001-10-01), None
Partial machine translation of JP 07-321,134A obtained from the JPO website.
Korean Office Action with English-language translation.

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