Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-06-28
2005-06-28
Mayes, Melvin C. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S089160
Reexamination Certificate
active
06911102
ABSTRACT:
A laminated type semiconductor ceramic element is provided with good PTC characteristics, low room temperature resistance value and improved withstand voltage of 15V or higher. Semiconductor ceramic layers made from a semiconductor ceramic containing barium titanate as the main component and the element nickel at about 0.2 mol % or less (excluding 0 mol %), and internal electrode layers are superimposed alternately, and an external electrode is formed so as to be connected electrically with the internal electrode layers. The production method comprises the steps of obtaining a laminated product of semiconductor material layers containing a barium titanate as the main component and about 0.2 mol % or less (excluding 0 mol %) of the element nickel, and internal electrode layers, obtaining a laminated sintered compact by reduction baking of the laminated product, forming an external electrode electrically connected with the internal electrodes of the laminated sintered compact, and re-oxidization processing.
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Japanese Office Action issed Apr. 22, 2003 (with English translation of relevant portion).
Japanese Office Action issed Dec. 24, 2002 (w/English translation of relevant portion).
Dickstein Shapiro Morin & Oshinsky LLP.
Mayes Melvin C.
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