Method and system for controlling the processing of an...

Details Method and system for controlling the processing of an... Method and system for controlling the processing of an...

2005-06-07

2005-06-07

Lebentritt, Michael (Department: 2812)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

Reexamination Certificate

active

06901984

ABSTRACT:
A method and system for controlling the processing of an IC chip assembly line using a central computer system and a common communication protocol. In one embodiment, a manufacturing execution system (MEM) is used as the computer system and the communications protocol is the standard semi equipment communications standard/generic equipment model (SECS/GEM). One or more equipment cell controllers (CC) may be used to communicate between the MES a plurality of in-line substations which comprise the assembly line. Automated vision camera systems may also communicate information to the MES via the CCs. In one embodiment, the MES maintains a database in memory comprising processing history of a die-strip and results of automated die-strip examination from the vision camera systems. In one embodiment, the die-strip may be of a ball grid array (BGA) type.

REFERENCES:
patent: 5547537 (1996-08-01), Reynolds et al.
patent: 6173750 (2001-01-01), Davis et al.

Affiliated with

Also associated with

Rating

Method and system for controlling the processing of an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and system for controlling the processing of an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for controlling the processing of an... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3515951