Method of manufacturing thin-film structure

Details Method of manufacturing thin-film structure Method of manufacturing thin-film structure

2005-06-14

2005-06-14

Tsai, H. Jey (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S050000, C438S052000

Reexamination Certificate

active

06905905

ABSTRACT:
A manufacturing method of a thin-film structural body, capable of preparing a thin-film structural body by using a sacrifice film without any protruding part on its surface, thereby preparing a thin-film structural body having high strength and reliability. After a sacrifice film is formed with a film thickness greater than a predetermined value, the surface of the sacrifice film is ground so that the surface of the sacrifice film is flattened with the film thickness of the sacrifice film being adjusted to the predetermined value. Thus, the influence of the surface irregularity of a substrate is eliminated and the surface of the sacrifice film is flattened. Thereby, a mass body, beams and fixed electrodes of a semiconductor acceleration sensor are prepared by using the sacrifice film.

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