Process of fixing a heat sink to a semiconductor chip and packag

Details Process of fixing a heat sink to a semiconductor chip and packag Process of fixing a heat sink to a semiconductor chip and packag

1994-09-09

1996-06-11

Fourson, George

Fishing, trapping, and vermin destroying

437221, 437902, H01L 2152, H01L 2154, H01L 2156, H01L 2158

Patent

active

055255485

ABSTRACT:
A process of manufacturing a semiconductor chip module by mounting a semiconductor chip on a substrate and contacting the chip with a heat sink. A cap is adhered to the substrate and an adhesive material is embedded in a gap between the heat sink and the chip and into a gap between the inner wall of an opening in the cap and the heat sink. As a result, the heat sink is fixed to the cap and the cap is hermetically sealed.

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