Semi-solid one- or two-part compositions

Details Semi-solid one- or two-part compositions Semi-solid one- or two-part compositions

2005-02-08

2005-02-08

Moore, Margaret G. (Department: 1712)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C524S369000, C523S176000, C206S813000, C428S447000, C428S500000

Reexamination Certificate

active

06852193

ABSTRACT:
A composition including at least one anaerobically polymerizable compound; and at least one condensation product of an aldehyde and or ketone/with a polyol. The invention also provides a composition as described above which is in the form of a soft solid, for example, in the form of a stick. A two-part composition is provided, comprising a first part containing at least one polymerizable compound; and a second part containing at least one curing component for polymerizing the composition, wherein at least one of the first or second parts additionally comprises at least one gelling or solidifying agent. A kit is provided comprising the composition according to the invention which includes at least one primer component and at least one carrier solvent for the primer component, and a second composition which includes at least one anaerobically polymerizable compound and at least one condensation product of an aldehyde and or ketone/with a polyol. A pack is also provided, comprising: a shaped mass of a composition which includes at least one anaerobically polymerizable compound and at least one condensation product of an aldehyde and or ketone/with a polyol, and a container (1) for the composition. The container (1) has a mechanism for expelling the shaped mass.

REFERENCES:
patent: 2895950 (1959-07-01), Kreible
patent: 3043820 (1962-07-01), Kreible
patent: 3218305 (1965-11-01), Krieble
patent: 3425988 (1969-02-01), Gorman
patent: 3547851 (1970-12-01), Frauenglass
patent: 3591438 (1971-07-01), Toback et al.
patent: 3599438 (1971-08-01), Blackwell et al.
patent: 3616040 (1971-10-01), Toback
patent: 3625875 (1971-12-01), Frauenglass
patent: 3625930 (1971-12-01), Toback et al.
patent: 3631154 (1971-12-01), Kawaguchi et al.
patent: 3651036 (1972-03-01), Watanabe et al.
patent: 3672942 (1972-06-01), Neumann et al.
patent: 3720656 (1973-03-01), Manaka
patent: 3846363 (1974-11-01), Ando et al.
patent: 3890407 (1975-06-01), Briggs, Jr. et al.
patent: 3898349 (1975-08-01), Kehr et al.
patent: 4007323 (1977-02-01), Malofsky
patent: 4008341 (1977-02-01), Kehr
patent: 4018851 (1977-04-01), Baccei
patent: 4092376 (1978-05-01), Douek et al.
patent: 4106971 (1978-08-01), Briggs, Jr. et al.
patent: 4112031 (1978-09-01), Gohlisch
patent: 4167616 (1979-09-01), Bollinger
patent: 4215201 (1980-07-01), Cerron
patent: 4257928 (1981-03-01), Vachon et al.
patent: 4287330 (1981-09-01), Rich
patent: 4309526 (1982-01-01), Baccei
patent: 4348503 (1982-09-01), Bachmann
patent: 4384064 (1983-05-01), Trotter et al.
patent: 4429088 (1984-01-01), Bachmann
patent: 4430480 (1984-02-01), Melody et al.
patent: 4447607 (1984-05-01), Johnson
patent: 4483956 (1984-11-01), Uchiyama
patent: 4497916 (1985-02-01), Cooke et al.
patent: 4515724 (1985-05-01), Ritter
patent: 4533422 (1985-08-01), Litke
patent: 4639475 (1987-01-01), Dierichs et al.
patent: 4656229 (1987-04-01), Chiao
patent: 4676868 (1987-06-01), Riley et al.
patent: 4808638 (1989-02-01), Steinkraus et al.
patent: 4963220 (1990-10-01), Bachmann et al.
patent: 4990281 (1991-02-01), Clark
patent: 5371131 (1994-12-01), Gierenz et al.
patent: 5433775 (1995-07-01), Gardenier et al.
patent: 5610251 (1997-03-01), Kneafsey et al.
patent: 5718977 (1998-02-01), Pocius
patent: 54 107993 (1979-06-01), None

Affiliated with

Also associated with

Rating

Semi-solid one- or two-part compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semi-solid one- or two-part compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semi-solid one- or two-part compositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3512730