Method of preparing cemented carbide or cermet alloy

Details Method of preparing cemented carbide or cermet alloy Method of preparing cemented carbide or cermet alloy

1995-04-04

1997-02-11

Derrington, James

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Metal and nonmetal in final product

264 63, 419 10, 419 14, 419 36, 419 37, 419 53, B22F 310

Patent

active

056030711

ABSTRACT:
Disclosed is a method of preparing a cemented carbide or a cermet alloy by mixing and kneading cemented carbide powder or cermet alloy powder with an organic binder, shaping this mixed powder into a prescribed configuration by an injection molding method and thereafter removing the organic binder from this compact and sintering the same, in order to obtain a dense alloy. Removal of the organic binder is performed in a first step in an inert gas atmosphere as a first removal step, and then continued in a second step in a vacuum of not more than 1 Torr. In the first removal step, the pressure is held in excess of the atmospheric pressure, to prevent the formation of imperfections in the compact. After continuous pores are formed in the interior of the compact, the atmosphere pressure is brought close to a vacuum, thereby facilitating the evaporation of gas from the surface and desorption of gas generated in the interior of the compact.

REFERENCES:
patent: 2939199 (1960-06-01), Strivens
patent: 3871630 (1975-03-01), Wanetzky
patent: 4305756 (1981-12-01), Wiech, Jr.
patent: 4836980 (1989-06-01), Kashiwadani et al.
patent: 5028367 (1991-07-01), Wei et al.

Affiliated with

Also associated with

Rating

Method of preparing cemented carbide or cermet alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of preparing cemented carbide or cermet alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of preparing cemented carbide or cermet alloy will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-351266