Semiconductor device and chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S775000, C338S0220SD, C338S023000

Reexamination Certificate

active

06975031

ABSTRACT:
There are provided a carrier substrate, a temperature sensing resistor film formed directly on the carrier substrate, first and second conductive patterns formed on the carrier substrate and connected to both ends of the temperature sensing resistor film respectively, and a semiconductor chip mounting region portion formed on the carrier substrate.

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Copy of European Patent Office Communication including European Search Report for corresponding European Patent Application No. 02250736 dated Apr. 16, 2002.

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