Via providing multiple electrically conductive paths through...

Details Via providing multiple electrically conductive paths through... Via providing multiple electrically conductive paths through...

2005-02-01

2005-02-01

Duverne, J. F. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Reexamination Certificate

active

06848912

ABSTRACT:
A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.

REFERENCES:
patent: 6613986 (2003-09-01), Hirose et al.
patent: 6651322 (2003-11-01), Currie
patent: 20030102151 (2003-06-01), Hirose et al.
Geoff Smithson, “Practical RF Printed Circuit Board Design,” presented at the Institution of Electrical Engineers (IEE) Training Event “How to Circuits,” (location unknown) Apr. 5, 2000, 6 pages.

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