Internal soldering in metal/ceramic composites

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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428632, 428674, 428673, 428675, 2281221, 2281241, B23K 100, B23B 700

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055254322

ABSTRACT:
The invention relates to a composite body in which a ceramic component and a metal component are bonded to one another by internal soldering. The internal soldering is effected with soldering composition in a recess (2) within a component (1) of the one material in which there is arranged a component (3) of the other material which is shaped to fit accurately. The recess (2) is, at at least one end-face opening, surrounded by a chamfer (5) having an angle .phi. smaller than 35.degree. C., while the wetting angle .beta. between the soldering composition and the plane of the component surface in which the recess is located is smaller than 40.degree..

REFERENCES:
patent: 3137545 (1964-06-01), Schultz
patent: 3507979 (1970-04-01), Erkan
patent: 4562121 (1985-12-01), Thiemann et al.
patent: 4988034 (1991-01-01), Taniguchi et al.
patent: 4996111 (1991-02-01), Do-Thoi et al.
patent: 5131582 (1992-07-01), Kaplan et al.
patent: 5156322 (1992-10-01), Do-Thoi et al.
patent: 5351874 (1994-10-01), Rajner et al.
patent: 5387441 (1995-02-01), Do-Thoi et al.
Manko, "Solders and Soldering", pp. 1-7, 251-262, 1964 (no month).

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