Semiconductor device, method of manufacturing the same,...

Details Semiconductor device, method of manufacturing the same,... Semiconductor device, method of manufacturing the same,...

2005-11-29

2005-11-29

Zarneke, David (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S684000, C257S737000, C438S110000, C438S125000

Reexamination Certificate

active

06969908

ABSTRACT:
A semiconductor substrate has an integrated circuit, an interconnect electrically connected to the inside of the semiconductor substrate, and an electrode formed on the interconnect. A plurality of resin layers are separately formed on the semiconductor substrate so that part of the semiconductor substrate is exposed. A redistribution interconnect is electrically connected to the electrode. An external terminal is formed on the redistribution interconnect and supported by the resin layers.

REFERENCES:
patent: 6696765 (2004-02-01), Kazama et al.
U.S. Appl. No. 10/637,614, filed Aug. 11, 2003, Yamaguchi.

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