Polishing apparatus

Details Polishing apparatus Polishing apparatus

2005-11-15

2005-11-15

Rose, Robert A. (Department: 3723)

Abrading

Machine

Rotary tool

C451S041000

Reissue Patent

active

RE038878

ABSTRACT:
A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.

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