Method for fabricating an IC interconnect system including...

Details Method for fabricating an IC interconnect system including... Method for fabricating an IC interconnect system including...

2005-06-28

2005-06-28

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C427S097100, C427S099300, C083S929100, C257S622000

Reexamination Certificate

active

06910268

ABSTRACT:
Vertical holes are created in streets separating individual integrated circuit (IC) dies formed on a semiconductor wafer, the holes spanning saw-lines along which the wafer is to be later cut to separate the IC die from one another to form individual IC chips. The holes are then filled with conductive material. After the wafer is cut along the saw-lines, portions of the conductive material on opposing sides of the saw-lines remain on peripheral edges of the IC chip to form signal paths between the upper and lower surfaces of the IC chips.

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