Method of high-speed and accurate alignment using a chip...

Details Method of high-speed and accurate alignment using a chip... Method of high-speed and accurate alignment using a chip...

2005-11-08

2005-11-08

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S739000, C029S740000, C029S720000

Reexamination Certificate

active

06961994

ABSTRACT:
A mounting device including a plurality of heads, each holding a chip, arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads with calibration marks, first recognition mechanism fixed in a chip mounting position, and second recognition mechanism fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads. In mounting operation, the first recognition mechanism recognizes the positions of a substrate and the calibration marks of the heads, whereas the second recognition mechanism recognizes the positions of chips attracted on the heads. The heads are moved vertically to adjust plane to be recognized. The chip and the substrate are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

REFERENCES:
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patent: 5070598 (1991-12-01), Itagaki et al.
patent: 5084962 (1992-02-01), Takahashi et al.
patent: 61-167802 (1986-07-01), None
patent: 7-7028 (1995-01-01), None
patent: 7-193102 (1995-07-01), None
patent: 11-87432 (1999-03-01), None

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