Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2005-02-15
2005-02-15
Hail, III, Joseph J. (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S006000, C451S008000, C451S010000, C451S286000, C451S287000, C451S288000, C451S289000, C451S526000, C451S527000, C451S529000
Reexamination Certificate
active
06855034
ABSTRACT:
An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance as well as methods for polishing of a semiconductor wafer using them. The polishing pad of the invention comprises a water-insoluble matrix material such as crosslinked 1,2-polybutadiene, and a water-soluble particle such as β-cyclodextrin dispersed in this water-insoluble matrix material, and has a light transmitting properties so that a polishing endpoint can be detected with a light.
REFERENCES:
patent: 5900164 (1999-05-01), Budinger et al.
patent: 6068540 (2000-05-01), Dickenscheid et al.
patent: 6074287 (2000-06-01), Miyaji et al.
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6500053 (2002-12-01), James et al.
patent: 6517417 (2003-02-01), Budinger et al.
patent: 1 046 466 (2000-10-01), None
patent: 9-7985 (1997-01-01), None
patent: 11-512977 (1999-11-01), None
patent: 2000-0034416 (2000-02-01), None
patent: 2000-326220 (2000-11-01), None
patent: WO 9706921 (1997-02-01), None
patent: WO 0143920 (2001-06-01), None
U.S. Appl. No. 09/867,541, filed May 31, 2001, Ogawa et al.
U.S. Appl. No. 09/983,097, filed Oct. 23, 2001, Hasegawa et al.
U.S. Appl. No. 10/030,141, filed Jan. 28,2002, Hasegawa et al.
U.S. Appl. No. 10/128,282, filed Apr. 24, 2002, Hasegawa.
U.S. Appl. No. 10/252,696, filed Sep. 24, 2002, Hasegawa et al.
U.S. Appl. No. 10/279,843, filed Oct. 25, 2002, Konnou et al.
U.S. Appl. No. 09/995,613, filed Nov. 29, 2001, Hasegawa.
Patent Abstracts of Japan, JP 2000-034416, Feb. 2, 2000.
Hail III Joseph J.
JSR Corporation
McDonald Shantese
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
LandOfFree
Polishing pad for semiconductor wafer and laminated body for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polishing pad for semiconductor wafer and laminated body for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing pad for semiconductor wafer and laminated body for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3503572